[{"data":1,"prerenderedAt":21},["ShallowReactive",2],{"post-cn-48":3},{"id":4,"sortId":5,"sortName":6,"sortSlug":7,"section":8,"slug":9,"path":10,"title":11,"subtitle":12,"date":13,"cover":14,"summary":15,"tags":16,"visits":17,"template":18,"bodyHtml":19,"videoUrl":12,"pics":20,"extTedian":12,"extYingyong":12,"extCanshu":12},48,"23","企业相册","s23","about","48","\u002Fabout\u002Fs23\u002F48","【发明专利】一种双负载多AGV调度方法（发明）","","2022-10-08 09:16:19","\u002Fstatic\u002Fupload\u002Fimage\u002F20241119\u002F1731998213809419.jpg","激光晶体加工工序中的粗抛(研磨)是晶体加工流程中的重要一环，它位于粗磨和细抛之间，旨在进一步改善晶体表面的粗糙度和平整度，为后续工序打下良好基础。以下是关于激光晶体加工工序中粗抛(研磨)的详细阐述：",[],157,"article","\u003Cp style=\"text-align: center;\">\u003Cimg src=\"\u002Fstatic\u002Fupload\u002Fimage\u002F20241119\u002F1731997942784942.png\" alt=\"专利1.png\"\u002F>\u003C\u002Fp>",[],1786178748793]